MiSTer FPGA Solid Copper Heatsink

The hybrid ARM / FPGA chip can reach very high temperatures when running complex MiSTer cores effecting overall stability resulting in errors or crashes.

This is the ultimate MiSTer heatsink, produced from a solid copper bar, the fins are manufactured by accurately peeling each fin from the bar of solid copper, they are an integral part of the copper base plate with no solder or interface joint for superior thermal radiation of heat. Designed to cover the Cyclone V FPGA chip, ensuring maximum heat dissipation and keeping your DE10 Nano cool and running at peak performance.

Installation of this solid copper heat sink adds highly efficient passive cooling for your MiSTer FPGA setup, when paired with a MiSTer IO Board with mounted fan you will have the ultimate active cooling solution.

Copper has excellent thermal conductivity nearly twice that of aluminium, which can significantly improve heat dissipation with the best possible performance within the allowed space constraints.

✅ MiSTer IO Board Compatible
✅ Excellent Passive FPGA Cooling
✅ 3M 8810 Thermal Conductive Adhesive Applied
✅ High Skived Fin Densities
✅ Solid Copper

Copper Heatsink Compatibility:
✅ Terasic DE10-Nano
✅ Retro Remake MiSTer Pi
✅ QMTECH Cyclone V